Wednesday, February 1, 2023

Huawei Tipped to Announce a New Chipset Based on New Packaging Technology This Year

Huawei is reportedly working on a new chipset designed using a new packaging technology. It has also been tipped that the preparations for Huawei Mate X3 foldable smartphone will begin in a couple of days.

from Gadgets 360 https://ift.tt/f7wP1xu

No comments:

Post a Comment