Xiaomi Mi 11’s purported screen protector has been leaked online to suggest its curved display and hole-punch design. The new Mi-series phone is likely to feature a camera bump at the back. It is also promised to come as one of the first phones to carry Qualcomm Snapdragon 888 SoC.
from Gadgets 360 https://ift.tt/3mE71Vq
Subscribe to:
Post Comments (Atom)
Recent Slider
5/Tech/feat-slider
Photography
3/Tech/post-per-tag
Categories |
No comments:
Post a Comment